Memory Test Socket

  • Provides optimized solution for all memory device/PKG and different test environments, from the smallest pitch ~ normal pitch (0.2P~1.0P).

Specifications

Package Type BGA, LGA, POP etc.
Available Pitch  0.2P~
Characteristics - Long life span.
- Low Cres, Low Contact force (Multi-PARA)
- High Speed, Low Powder, High Voltage Test Solution
- No Ball Damage
- Available For ESD
Product Series
  • Package Type DDR
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Available For ESD
    - Low Cres
    - Low Contact Force
  • Package Type LPDDR
    Pitch 0.2P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Available For ESD
    - High Speed
    - Low Powder
  • Package Type NAND
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Long Time Test
    - No Ball Damage
    - High Speed
    - Dual Contact (BGA+LGA)
  • Package Type MCP
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Available For ESD
    - High Speed
    - Low Powder
    - Low Cres
  • Package Type DDR
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Low Cres
    - Low Contact Force
  • Package Type LPDDR
    Pitch 0.2P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type NAND
    Pitch 0.3P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
    - Low Contact Force
    - Dual Contact (BGA + LGA)
  • Package Type NAND Flash
    Pitch 0.4P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
  • Package Type MCP
    Pitch 0.3P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
    - Low Contact Force