Provides optimized solution for all memory device/PKG and different test environments, from the smallest pitch ~ normal pitch (0.2P~1.0P).
Specifications
Package Type
BGA, LGA, POP etc.
Available Pitch
0.2P~
Characteristics
- Long life span. - Low Cres, Low Contact force (Multi-PARA) - High Speed, Low Powder, High Voltage Test Solution - No Ball Damage - Available For ESD
Product Series
Customized Solution for your needs
ISC has international offices around the world, including USA, Vietnam, and has partnerships with over 330 leading Domestic and national semiconductor companies in the world.
