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Products

iSP

  • Probe Head

    High Technology POGO Probeおよび超精密加工Plateの組み合わせで最適化されたWafer Probing Solutionをご提供します。MEMS工程を適用した高性能MEMS Probe Headは、Low Force、High CCC、高強度 Materialの優れたContact特性で、お客様に合わせたSolution対応が可能です。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    Dut Side Of Contact部をMEMS工程を適用して製作したPyramid PINはHigh Hardness(Hv1000)で耐摩耗性、Sharp Contact TipでContact特性に優れ、お客様に合わせたSolution対応が可能です。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
  • Battery PIN

    最高の技術とノウハウを基に、Lithium-Polymer Batteryの充電および放電テストに適したSolutionをご提供します。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

Low Cres

Low Contact Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Dual Contact
(BGA+LGA)

Package Type

BGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

LGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

QFP

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

High Speed

Low Cres

  • RF Socket

    独自の技術力、同軸構造でインピーダンスをマッチングし、優れた特性および高い周波数に対応するRFテストソケットをご提供します。

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc
    Available Pitch

    0.7P~

    0.4P~
    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES
Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES