Products

iSP

  • Probe Head

    The optimized Wafer Probing Solution with the combination of high technology POGO probe and ultra-precision processing plate is provided. High Performance MEMS Probe Head applied with the MEMS process can respond to customized solutions for each customer with excellent contact characteristics of Low Force, High CCC, and high-strength material.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    Pyramid PIN manufactured by applying the MEMS process to the Dut Side Of Contact part can respond to customized solutions for each customer with excellence in wear resistance with high hardness (Hv1000) and contact characteristics with sharp contact tip.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
  • Battery PIN

    Based on the best technology and know-how, solution suitable for testing the charging and discharging of Lithium-Polymer Battery is provided.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

Low Cres

Low Contact Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Dual Contact
(BGA+LGA)

Package Type

BGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

LGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

QFP

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

High Speed

Low Cres

  • RF Socket

    By matching impedance with unrivaled technology and coaxial structure, RF test sockets with excellent characteristics and high frequency response is provided.

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc
    Available Pitch

    0.7P~

    0.4P~
    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES
Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES