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Memory Test Socket
From the Smallest Pitch to Normal Pitch (0.2P~1.0P), the optimized solution for all Memory Device/PKG and various testing environment is provided.
Specifications Package TypeBGA, LGA, POP etc.
Available Pitch0.2P~
CharacteristicsLong life span.
Low Cres, Low Contact force (Multi-PARA)
High Speed, Low Powder, High Voltage Test Solution
No Ball Damage
Available For ESD
Product Series
DDR
0.3P~
Long life span
No Ball Damage
Available For ESD
Low Cres
Low Contents Force
LPDDR
0.2P~
Long life span
No Ball Damage
Available For ESD
High Speed
Low Powder
NAND
0.3P~
Long life span
No Long Test
No Ball Damage
High Speed
Dual Contact
(BGA+LGA)
MCP
0.3P~
Long life span
No Ball Damage
Available For ESD
High Speed
Low Powder
Low Cres
NAND Flash
0.4P~
Long life span
High Speed
Low Cres
MCP
0.3P~
Long life span
High Speed
Low Cres
Low Contact Force
