Products

iSTCU

  • Camera Module Socket

    ISC的Auto Socket可以根据客户需求，制作成多种形态。此外，基于测试插座市场长期以来积攒的经验，确保最佳的水准及Contact性，并拥有不同于传统的新概念的驱动方式。

    Specifications
    CCM Auto Socket MEMS Probe Head
    Package Type

    Bottom Move

    Top Move
    Available Pitch

    0.3, 0.35mm~

    0.3, 0.35mm~
    Characteristics

    Non-Magnetic

    Non-Magnetic
Product Series
Package Type

Around View

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Twin VCM

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Single Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Triple Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

  • Interposer

    ISC Interposer具备卓越的Contact稳定性，是根据客户的要求事项，采用Special Rubber Solution的定制型产品。

    Specifications Package Type

    Board to Board, Probe card etc

    Available Pitch

    0.4P ~

    Characteristics

    High contact stability

    No board damage

    No bending

    Low force, Low Cres

Product Series
Package Type

B to B

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

Package Type

Probe Card

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

  • Test Fixture

    针对Mobile、D-TV、Network、Module等多种Package，可以提供采用Rubber、POGO Socket的系统测试方案。

    Specifications Package Type

    BGA, LGA, QFN etc

    Available Pitch

    0.3P~

    Characteristics

    Mobile Application Processor

    PMIC, RFIC, Memory IC, NFC

    Module, SSD, etc

Product Series
Package Type

748FBGA, 168FBGA

Pitch

0.4P~

Characteristics

Mobile AP + LPDDR Test

Package Type

64FBGA

Pitch

0.4P~

Characteristics

Mobile NFC Test

Package Type

96FBGA

Pitch

0.8P~

Characteristics

SSD Test

Package Type

556FBGA

Pitch

0.4P~

Characteristics

Mobile LPDDR Test

Package Type

153FBGA

Pitch

0.5P~

Characteristics

Navigation Test

Package Type

16LGA

Pitch

0.5P~

Characteristics

RF Chip Test

Package Type

556FBGA

Pitch

0.8P~

Characteristics

Module Test

Package Type

929FCPBGA

Pitch

0.75P~

Characteristics

D-TV Test

Package Type

48TSOP, 48QFP

Pitch

0.5P~

Characteristics

USB Test

  • Board Saver

    ISC Board Saver可以最大程度减少Probe对PCB Pad的损伤。此外，对于正在使用的PCB，Board Saver的镀金particle也可以大幅提升测试效率。

    Specifications Package Type

    All including BGA, QFN, QFP, TSSOP and etc

    Available Pitch

    0.35mm~

    Characteristics

    Minimize damage on PCB Pad

    Improve Test Yield

    Available for re-routing

    Simple installment and maintenance

  • Chiller
    Specifications
    Target Temp

    -40 ~ 120℃
    Heating Capacity.

    120℃ @360w
    Cooling Capacity(1Peltier)

    -40℃ @40w
    Cooling Capacity(2Peltier)

    -40℃ @80w
    Accuracy

    Target Temp±1℃
    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)
    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)
    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)
    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (80W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃
    Heating Capacity.

    120℃ @360w
    Cooling Capacity(1Peltier)

    -40℃ @40w
    Cooling Capacity(2Peltier)

    -40℃ @80w
    Accuracy

    Target Temp±1℃
    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)
    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)
    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)
    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (40W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃
    Heating Capacity.

    120℃ @360w
    Cooling Capacity(1Peltier)

    -40℃ @40w
    Cooling Capacity(2Peltier)

    -40℃ @80w
    Accuracy

    Target Temp±1℃
    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)
    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)
    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)
    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head