Products

iSP

  • Probe Head

    High Technology POGO Probe与超精密加工Plate相结合，提供最佳的Wafer Probing Solution。采用了MEMS工艺的高性能MEMS Probe Head具有Low Force、High CCC、高强度Material的优秀的Contact特性，可以为每位客户提供定制型解决方案。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    将Dut Side Of Contact单元适用MEMS工艺，制作的Pyramid PIN具有High Hardness（Hv1000），耐磨性出色；且采用Sharp Contact Tip，Contact特性卓越。因此，为每位客户提供定制型解决方案。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
  • Battery PIN

    基于顶级的技术和经验，提供适用于锂聚合物电池（Lithium-Polymer Battery）充放电测试的解决方案。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

Low Cres

Low Contact Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Dual Contact
(BGA+LGA)

Package Type

BGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

LGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

QFP

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

High Speed

Low Cres

  • RF Socket

    采用独家技术、同轴结构，与阻抗向匹配，提供应对优秀特性和高频的RF测试插座。

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc
    Available Pitch

    0.7P~

    0.4P~
    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES
Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES