Products

iSC

  • Memory Test Socket

    从极小Pitch到Normal Pitch (0.2P~1.0P)，提供适合所有Memory Device/PKG及多种Test环境的最佳的解决方案。

    Specifications Package Type

    BGA, LGA, POP etc.

    Available Pitch

    0.2P~

    Characteristics

    Long life span.

    Low Cres, Low Contact force (Multi-PARA)

    High Speed, Low Powder, High Voltage Test Solution

    No Ball Damage

    Available For ESD

Product Series
Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Available For ESD

Low Cres

Low Contents Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

No Ball Damage

Available For ESD

High Speed

Low Powder

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

No Long Test

No Ball Damage

High Speed

Dual Contact
(BGA+LGA)

Package Type

MCP

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Available For ESD

High Speed

Low Powder

Low Cres

Package Type

NAND Flash

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

MCP

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

  • Logic Test Socket

    Long Test Time、Short Test Time、High Speed, 大面积等Application下，提供最适合Logic Device/PKG. Test的解决方案。

    Specifications Package Type

    BGA, LGA, QFN, QFP, CSP, SOP, TSOP etc.

    Available Pitch

    0.25P~

    Characteristics

    AP, CPU, GPU, PMIC, RF, Sensor, Mixed signal

    Validation, SLT, ATE

    Low Cres, High Speed, High Voltage Test Solution

    No Ball Damage

    Customizing Test

Product Series
Package Type

AP

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

CPU

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

GPU

Pitch

0.5P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force