Products

iSB

  • Burn In Socket

    作为利用了橡胶的Burn In Test Socket，实现了Device No Ball Damage、PCB No Soldering、Hi Speed等优秀的特性及结构，为客户提供量身定制的最佳的解决方案。

    Specifications
    DC BI Socket Normal BI Socket High Speed BI Socket
    Package Type

    BGA, LGA etc.

    BGA, LGA, QFN etc.

    BGA etc.
    Available Pitch

    0.3P~

    0.3P~

    0.8P~
    Characteristics

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    - No Ball Damage

    Easy To Repair Board

    Hi Speed Test
Product Series
Package Type

BGA, LGA etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Package Type

BGA, LGA, QFN etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

High speed response

Package Type

BGA etc

Pitch

0.8P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Easy to repair board