Logic Test Socket

  • Provides optimized solution for logic device/PKG test in accordance with the application, including long test time, short test time, high speed, large area, etc.

Specifications

Package Type BGA, LGA, QFN, QFP, CSP, SOP, TSOP etc.
Available Pitch 0.25P~
Characteristics - AP, CPU, GPU, PMIC, RF, Sensor, Mixed signal
- Validation, SLT, ATE
- Low Cres, High Speed, High Voltage Test Solution
- No Ball Damage
- Customizing Test
Product Series
  • Package Type AP
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type CPU
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type GPU
    Pitch 0.5P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type BGA
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type LGA
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Validation, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type QFP
    Pitch 0.4P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
  • Package Type QFN
    Pitch 0.35P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres