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Burn In Socket

Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.

Specifications

DC BI Socket
Normal BI Socket
High Speed BI Socket
Package Type
BGA, LGA etc.
BGA, LGA, QFN etc.
BGA etc.
Available Pitch
0.3P~
0.3P~
0.8P~
Characteristics
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Easy To Repair Board
- Hi Speed Test
Product Series
Customized Solution for your needs


ISC has international offices around the world, including USA,
Vietnam, and has partnerships with over 330 leading 
Domestic and national semiconductor companies in the world.

Address : Keumgang Penterium IT Tower 6F, 215 Galmachi-ro, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea / Tel: Tel: +82-31-777-7675 / Fax: +82-31-777-7699 / 원격지원 : 팀뷰어코이노


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