Burn In Socket

  • Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.

Specifications

DC BI Socket Normal BI Socket High Speed BI Socket
Package Type BGA, LGA etc. BGA, LGA, QFN etc. BGA etc.
Available Pitch 0.3P~ 0.3P~ 0.8P~
Characteristics - Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Easy To Repair Board
- Hi Speed Test
Product Series
  • Package Type BGA, LGA etc.
    Pitch 0.3P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage
  • Package Type BGA, LGA, QFN etc
    Pitch 0.3P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage.
    - Hi Speed Response
  • Package Type BGA etc.
    Pitch 0.8P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage,
    - Easy To Repair Board